Versatile 355nm PCB High Precision Laser Cutter For Depaneling ML-CT-A01-500W
Description
This is a laser system that is used for depaneling, separating, and singulating of individual circuit boards from an array of many boards on one large panel. It is an alternative method with distinct advantages over other forms of PCB depaneling such as routers, dicing saws or die punches. PCB laser cutting uses a high-powered beam to cut material based on computer software controlled parameters.
Versatile 355nm PCB High Precision Laser Cutter For Depaneling ML-CT-A01-500W
Specifications |
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|---|---|
| Work Area / Panel Length: | 450 mm |
| Work Area / Panel Width: | 450 mm |
| Work Area / Panel Thickness (Max): | 0.4 mm |
| Scan Field: | Not specified |
| Scan Speed: | 2000 mm/sec |
| Laser Output Power: | -- W |
| Laser Wavelength: | 355 nm |
| Axis Speed (X): | -- mm/sec |
| Axis Speed (Y): | -- mm/sec |
| Axis Speed (Z): | -- mm/sec |
| Accuracy: | 7 um |
| Panel Material: | FR4, Rigid PCB, Double-Sided PCB |
Features
- No stress to the circuit boards. In contrast, mechanical methods are hard on the solder joints of a PCB.
- No Burrs: Laser-cut boards edge is smooth and clean, there is no need for further downstream processing.
- No particles: Lasers do not create the dust particles as generated by traditional mechanical cutting methods such as dicing saws and routers. Therefore, any downstream cleaning can be eliminated entirely from the production line. This is especially important for PCBs with optical components such as camera lenses, but also helps to reduce failures of on-board sensors.
- Versatility: Lasers are significantly more versatile than mechanical methods on both the application and material side. They are typically able to cut, drill, ablate metal, and skive a wide variety of PCB materials such as FR4, Rogers microwave substrates, Polyimide, fired ceramics, LTCC and so on.
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
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How to order?
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Ships from:
China
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Sold by:
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On FindLight:
External Vendor
Claim Shenzhen Herolaser Equipment Co., Ltd. Page to edit and add data
Frequently Asked Questions
The laser cutter is used for depaneling, separating, and singulating individual circuit boards from a larger panel.
Laser cutting has distinct advantages over other methods such as routers, dicing saws, or die punches. It does not cause stress to the circuit boards and produces smooth and clean edges without the need for further processing.
No, lasers do not create dust particles like traditional mechanical cutting methods. This eliminates the need for downstream cleaning in the production line.
The laser cutter is versatile and can cut, drill, ablate metal, and skive a wide variety of PCB materials such as FR4, Rogers microwave substrates, Polyimide, fired ceramics, LTCC, and more.
The laser cutter operates at a wavelength of 355nm and requires an electricity demand of 220V/50Hz/32A. It has an effective cutting range of 450mm*450mm, a cutting thickness of ≤0.4mm, and a cutting speed of ≤2m/s.