microDICE Enabling TLS-DicingTM System
Description
3D-Micromac’s high-performance microDICE™ laser dicing system separates wafers into dies using TLS-Dicing™ technology (Thermal-Laser-Separation). microDICE™ significantly reduces the dicing cost per wafer compared to traditional separation technologies. At the same time, cleaving with microDICE™ provides outstanding edge quality while increasing yield and process throughput. This is particularly true for silicon carbide (SiC) substrates, which are hard and brittle.
microDICE Enabling TLS-DicingTM System
Specifications |
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|---|---|
| Wafer Size: | 300 mm (~12 in) |
| Spindle Rotation Speed: | -- rpm |
| X-Axis Stroke (Cutting Range): | -- mm |
| X-Axis Speed: | 300 mm/s |
| X-Axis Resolution: | -- um |
| Y-Axis Stroke (Cutting Range): | -- mm |
| Y-Axis Speed: | 300 mm/sec |
| Y-Axis Resolution: | -- um |
| Z-Axis Stroke: | -- mm |
| Z-Axis Speed: | 300 mm/sec |
| Z-Axis Resolution: | -- um |
| Materials: | Silicon, Glass |
| Weight: | -- kg |
| Electrical Requirements: | Other / Not Specified |
| Max Power Consumption: | ~ 5 kVA |
| Dimensions: | 2005 x 2000 x 2090 mm |
Features
- Automated wafer handling
- Second unit for scribing
- SECS/GEM interface
- Filter fan unit
- Drying unit
- Significant higher throughput due to dicing speed up to 300 mm/s
- Minimal cost of ownership
- The ability to produce more dies per wafer by reducing street width
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
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Ships from:
Germany
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Sold by:
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On FindLight:
External Vendor
3D Micromac
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Frequently Asked Questions
microDICE significantly reduces the dicing cost per wafer compared to traditional separation technologies.
The available options for microDICE include automated wafer handling, second unit for scribing, SECS/GEM interface, filter fan unit, and drying unit.
The maximum dicing speed of microDICE is up to 300 mm/s.
The microDICE Enabling TLS-DicingTM System is a high-performance laser dicing system that separates wafers into dies using TLS-DicingTM technology.
microDICE can handle up to 300 mm (12“) wafer size.