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Frequently Asked Questions

The EXPEGO laser machine is used for high-precision applications in the electronic and precision engineering industries, such as microvia drilling, cutting, structuring, and cavity formation in PCBs.

The EXPEGO can handle substrates with dimensions of 610 x 460 mm and 635 x 540 mm.

The key features of the EXPEGO laser machine include processing multiple substrates in parallel, a flexible chuck design, a high precise and ultrafast laser system, automatic camera calibration, and an automated vision system for precision alignment.

Yes, the EXPEGO laser machine is Industry 4.0 ready, meaning it can integrate with other automated systems and processes.

The applications of the EXPEGO laser machine include laser drilling, laser depaneling, laser scribing, and laser ablation.

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