Laser Drilling Machine TLC-2H22
Description
TLC-2H22 is a new high power laser drilling machine equipped with a high speed scanning system to greatly enhance production efficiency.
High rigidity worktable combined with Tongtai's control system which allows the machine to have a positioning accuracy of lower than ±3μm and a drill precision of lower than ±15μm.
New image processing technology that has enhanced noise processing and contract enhancement functions Improving sub-layer targeted image recognition, allowing for a stable targeted drilling process technology.
High peak power laser and unique optical system design, improving copper foil drilling quality, ideal for direct drilling of black oxide copper foil and brown oxide copper plates.
Laser Drilling Machine TLC-2H22
Specifications |
|
|---|---|
| Materials: | Brass, Copper, Iron, Leather, Paper, Plastic, Silver, Steel, Textile |
| Laser Output Power: | 350 W |
| Laser Type: | CO2 Laser |
| Working Area: | 150 x 220 mm (6" x 9") |
| Features: | Camera, Double Head |
Features
- Direct drilling of black oxide copper foil
- Drilling brown oxide copper plates
For pricing, technical or any other questions please contact the supplier
- No registration required
- No markups, no fees
- Direct contact with supplier
Contact Supplier
How to order?
-
Ships from:
Taiwan
-
Sold by:
-
On FindLight:
External Vendor
Claim Tongtai Page to edit and add data
Frequently Asked Questions
The TLC-2H22 laser drilling machine has a positioning accuracy of lower than ±3μm.
The TLC-2H22 laser drilling machine has a drill precision of lower than ±15μm.
The TLC-2H22 laser drilling machine can directly drill black oxide copper foil and brown oxide copper plates.
The TLM PCB Smart Manufacturing system supports the monitoring and management of drilling machines, routing machines, and laser drilling machines. It provides features such as alarm management, broken tool management, utilization management, and remote control.
The SDL Series Linear Motor Drilling Machine is suitable for IC packaging BGA, vehicle carrier boards, communication infrastructure, and server boards' multilayer drilling process (5G construction).